Numerical Simulation for Temperature Field of Chamfered Mold and Solidification Process
(Room 205B)
09 May 17
3:30 PM
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4:00 PM
The temperature field of chamfered mold copper plate was calculated by the numerical simulation method. The results show that the maximum temperature of the chamfered part copper plate is increased linearly with the increase of chamfered angle. The maximum temperature of chamfered part copper plate increased from 280 to 342°C when the chamfered angle increased from 22° to 45°. The copper plate life decreases with the increasing of the chamfered angle. Therefore, the chamfered angle should not be too large or too small, and generally 20°~40° is appropriate. Industrial practice proves that the numerical simulation result is reasonable.