ChirpE - SEMICON West 2016: 3D-Micromac AG

3D-MICROMAC BRINGS ENABLING, LOW COST-OF-OWNERSHIP LASER MICROMACHINING SOLUTION TO VOLUME SEMICONDUCTOR WAFER AND POWER DEVICE PROCESSING

Company also expands North American operations with new applications lab and service/support facility to meet growing customer demand for TLS-Dicin... More...