SEMICON Korea 2018
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TECHNIC KOREA
 
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Elevate® Cu 6340
Low stress copper bath that can be used for RDL and general purpose semiconductor plating. Plates at 1 – 2 microns/minute with virtually no inter...
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TechniStrip® NF52
Advanced formula that is designed to offer full dissolution with excellent metal compatibility and high loading capacity. Solvent based stripper
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TechniStrip® P1331
An advanced photoresist stripper that has a wide range of applications from DUV to thick negative resins and passivation layerreworking. Ideal for ...
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TechniEtch TBR19
Fluoride free, aqueous etchant designed to selectively remove titanium or titanium alloy (TiN, TiW) barrier layers.
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Real Time Analyzer - 3D
This system utilizes all the technology found in the well-established RTA system with additional features to increase reliability and robustness.
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Elevate® Gold 7990
Electrolytic non-cyanide gold process that produces pure, soft gold deposits.
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