SEMICON Korea 2019

Sessions Speakers Exhibitors Products Press Releases Floor Plan

Rigaku Corporation 

WX310

반도체용 형광 X-선 분석장치 - Wafer size : up to 300mm - Multi layer film analysis - 동시 분석 film thickness and composition - FOUP (SMIF) 장착 가능 - Multi point measuremment - GEM 300 대응