Innovative sensing designs require highly precise, automated modes of handling at the wafer level. If not handled properly, environmental factors can greatly reduce overall yield or worse, completely destroy your wafer. GDSI has over 20 years of engineering knowledge aimed at defect reduction and process repeatability, employing a highly automated process flow for sensing devices. Whether you are encapsulating your devices using a carrier wafer or exposing your device layer to the environment, GDSI knows how to achieve maximum yield. Mechanical dicing using Disco machinery is available for most applications. Stealth Dicing is available for more discriminating applications. Temporary or permanent wafer bonding can be made available.
Product Categories
- Aerospace
- Automation Sensors
- Fiber Optics
- Infrared Detectors
- Internet of Things
- Optical
- Pressure
- Sensors/System Components
- Temperature
- Wireless