Sensors Expo 2017

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Products (4)

Wafer-Level-Capping

Wafer Level Capping is a custom glass capping service which hermetically encapsulates sensitive chip areas in the early stage of circuit packaging More...

Lithoglas for Anodic Bond

Lithoglas micro-structured substrates are excellent as interface layers for the highly stable joining of substrates by anodic bonding More...

Lithoglas Structured Passivations

Lithoglas passivations are micro-structured coatings that can be used as surface passivation for the hermetic sealing of sensitive chip areas More...

Opto Cap Wafers for SMT Packaging

Lithoglas Opto Cap Wafers for Surface-Mount packages consist of structured glass film on transparent substrates, providing a hermetic seal. Typical... More...