Overcoming the Challenges of Testing in Harsh Aerospace and Industrial Environments
(Room 204)
10 Jun 15
2:40 PM
-
3:20 PM
Tracks:
MEMS, MEMS & Sensors
As test environments become harsher (higher temperature, higher-g, faster rise times) and test application requirements become more demanding (smaller, lighter, more stable, higher bandwidth, lower noise), obtaining meaningful data becomes more challenging. This presentation will feature practical solutions and data obtained in challenging environments using MEMS and PE sensor technologies. In this session, attendees will learn: the harmful effects of mass loading in vibration measurements and learn practical steps and techniques they can take to minimize its effect and maximize the accuracy of their test data, how to decide which technology (PE, IEPE, MEMS PR, VC) is right for their test application, advantages and disadvantages of each sensor technology will be compared using test data, when to use a triaxial accelerometer for their test application, what trade-offs to consider, and what precautions to take during set-up and test planning, and what special challenges need to be considered for high-g shock and Pyroshock test measurements, and when to use damped vs. undamped shock accelerometers.