(co-hosted with the FlexTech Alliance and NextFlex)
Flexible and hybrid microelectronics have the potential to drive significant advances medical, wearable, imaging, industrial and other IoT applications. But how do we package these devices to interact with a variety of environments when the package is the system is the product? Challenges include materials integration for human and harsh environments, interconnect for heterogeneous devices, along with a wide array of form factors. This session will look at recent developments in packaging and assembly technologies that will help to bring some of these emerging devices to commercialization.
