Abstract:
Photonics has dominated long range data transmission for many years due to advantages of bandwidth, cost, latency and power over the alternatives. The packaging of components for this application is mature. The need for these same advantages in networks and products connected to networks is driving a revolution in photonic packaging. System level integration at package level is emerging as a key to maintaining progress when Moore’s Law scaling is no longer the driver. Photonics to a system-in-package architecture (SiP) with heterogeneous integration poses many difficult challenges but it is the solution to maintain progress in product performance, size, latency, bandwidth, power and cost.