Abstract:
Given the growth of IoT applications, the demand for increasingly efficient microprocessors is on the rise. This requires the development of solutions with low-power consumption, low latency, embedded security, and integrated high-speed connectivity. As a result, this demand is driving research and development in silicon fabrication, package architecture, and manufacturing/test processes. Designing and developing for IoT use cases requires every increasing levels of efficiency and quality in the product life cycle. Collaboration with customers in every stage of development is a must to achieve these new requirements.
To drive this new level of efficiency, the IC industry must take advantage of the promise of IoT by exposing insights to the information available today through data analytics. The ability to optimize equipment usage, manufacturing execution, and process control drives down the development cycle time and minimizes excursions. In addition, data analytics allows technology to be transferred to high-volume manufacturing in a more efficient and predictable way.
Since the equipment infrastructure in the IC sector spans multiple generations, a key first step is to enable legacy systems with sensor technology to create increased awareness. Aware equipment can be connected and networked in a systematic way to create a map of the manufacturing environment whereby analytics can extract the actionable insights and business value. As the application of IoT drives technology development in the IC segment, it will benefit through a system architecture that connects IT to OT to reduce the fragmentation of implementation throughout a factory.