Abstract:
Leading edge wafer fabs arguably represent one of the most complex manufacturing processes on the planet today. Building and aligning dozens of defect-free layers of materials comprised of billions of electrically-active nano-scale patterned elements replicated across fragile 300mm silicon wafers requires the highest degree of environmental and process control available.
While a great deal of progress has been made to date to realize such technological achievements, the companies who produce advanced silicon devices must continue to implement creative and innovative ways in which to maximize yields and minimize costs along the way in order to remain competitive. Automated Process Control (APC) and data analytics have found heavy use in recent years to tackle the most impactful of these areas, and now the stage is set to drive the next wave of activities aimed at increasing automation and improving process cost and device performance even further.
This talk will explore and report in more detail what today's advanced wafer fab issues are in terms of the physical sensors that monitor the equipment and environment, the management of the massive quantity of data in both its volume and structure, and the recommended levels to which information security should be kept throughout the supply chain. A challenge to engineers and industry leaders will be summarized in an effort to focus cross-boundary efforts. These efforts are hoped to pave the way for a future business environment where efficiency improvements are made available to all via common tools and standardization while still leaving room for companies to create and maintain their own competitive advantages.