Interconnects pose a potential weak link as technology scaling proceeds to tighter pitch. This area scaling leads to tighter pitches in the BEOL pushing the limits of pattering and material systems. In order to overcome these challenges simultaneous optimization of novel metallization, new materials, and alternative integration schemes are required for next generation interconnects. However, interconnects can also enable new architectures and offer functionality away from the traditional FEOL. Such integration opportunities also create new challenges and different demands on materials and processes. This talk will discuss recent progress and remaining challenges as we look to enable continued scaling and add greater functionality.