Abstract:
The electronic and software content in devices has seen exponential growth in the recent past and the trend is expected to strengthen. As form factors become flexible and connectivity becomes ubiquitous, engineering teams face the challenge of satisfying increasing number of design goals that are highly interdependent.
In this presentation, we shall discuss simulation approaches that reduce overall product design time and minimize design errors by facilitating concurrent design of both mechanical and electromagnetic aspects. The structural design aspects include stiffness, durability etc. while the electromagnetic design aspects include wireless design, EMC/EMI and signal integrity. We shall also demonstrate a co-simulation methodology to improve the result accuracy of engineering problems involving strong coupling between structural and electromagnetic domains.