Abstract:
Considering that the packaging of MEMS and sensors exceeds 60% of the total product costs, one must apply packaging-related lessons learned from other device package technologies (e.g., integrated circuits, electro-optics, and photovoltaics). The choosing the best package interconnect strategy and material sets will assure successful productization. This presentation will highlight the roles of innovation, chip-package co-design, design for manufacturability, and new materials/processes/equipment in MEMS & Sensors packaging.