Abstract:
This investigation focuses on improving the initial quality and yield of a medical device by re-designing the flexible polyimide substrate, developing suitable interconnect metallurgy for assembly and reliability, selection of an appropriate solder paste. Once the materials and design were optimized, the assembly process was developed. From screen printing and designing the proper fixture to placement and soldering steps, developing the assembly process was a nontrivial endeavor that required novel solutions in order to achieve a high yield and reliable product manufactured in a high volume environment. This case study takes a step by step approach on the material and process challenges encountered and the innovations developed to bring this medical device to market.