2019 SVC TechCon

Electron Beam Additive Manufacturing of Copper Radio-Frequency Devices (Room Room 104-B)

02 May 19
4:00 PM - 4:20 PM

Tracks: High-Powered Electron Beam Technology

Copper radio-frequency (RF) devices are complex structures with stringent geometric and material requirements. These integrated assemblies include mechanical, electrical and thermal design features, and are used in the medical, communications and research industries. Current manufacturing methods involve subtractive machining and brazing, a process which leads to extensive development efforts and long manufacturing lead times. Metal Additive Manufacturing (AM) is increasingly seen as a process which can fabricate complex components while circumventing many operations and logistics issues. These applications generally utilize structural alloys such as Steel, Titanium, Aluminum, etc. In this presentation, we will discuss the opportunities and challenges of printing RF devices from high purity copper. With support from North Carolina State University, a highly modified electron beam powder bed fusion process will be introduced. Issues related to component design, powder handling, electron beam optics, digital controls and post-processing will be discussed. While significant improvements have been made, areas of future research and collaboration will be emphasized.