2019 SVC TechCon

Multinary HiPIMS for Cutting Tools (Room Room 104-A)

30 Apr 19
11:00 AM - 11:20 AM

Tracks: High Power Impulse Magnetron Sputtering – HIPIMS

HiPIMS is dense, smooth films of an almost unlimited choice of materials. Hard milling as an interrupted cutting process benefits from high Si content; only possible with the favorable H/E ratio of the dense HiPIMS morphology. And it paves the way for using TiB2 for cutting TiAl6V for aerospace. Carbon containing films such as TiCN and WC/C dominate tap tool applications. All this variety gives HiPIMS a new challenge: multinary coatings of materials with rather different properties. This paper will introduce a new HiPIMS control concept offering for every source an individual set of HiPIMS pulse parameters. Now the coating designer can take the very different ionization potentials into account or select a source for heavy ion bombardment while the other ones are optimized for highest sputtering rate as 2 µm/h for AlTiN. All this with full synchronization of the HiPIMS cathodes to the HiPIMS table bias to minimize intrinsic stress in the film for extreme coating thickness of 10 µm on indexables. Data from plasma analysis and case studies from the cutting tool industry will illustrate the benefit of this control concept for multinary HiPIMS.