SEMICON Korea 2019

Sessions Speakers Exhibitors Products Press Releases Floor Plan

S6. Electopackage System and Interconnect Product (Room #317, COEX)

[Packaging Growth through Technology Diversification] Thanks to the semiconductor’s evolution, electronics markets are significantly expanded from the mainframe computing era to the mobile computing era. Today it is facing the 4th industry generation requires intelligence network in addition to performance excellence. For supporting this, every semiconductors area’s involvement, Design-Chip-Packaging-Test, is needed. Especially packaging technology’s flexibility and confrontation-ability will play a particularly important role with packaging as an Advanced-FOWLP using 3D IC and 2.5D IC, MEMS/Sensor, SIP, vertical integration package, and mature package’s advancing. It is challengeable. But this session will be helpful for understanding the new advanced packaging technologies.​ Too see session agenda, Please Click here