SEMICON West 2016

Doug Yu
Senior Director of Integrated Interconnect and Package Technology
TSMC


Douglas Yu is in charge of TSMC Advanced Package R&D. His team has developed and delivered CoWoSTM and InFO, industry first Si interposer technology, and first high-density 3D-FOWLP, respectively. Doug was previously responsible for the development industry’s first Cu/Low-K on-chip interconnect from TSMC 0.13m technology. He is an IEEE Fellow.

Sessions :