SEMICON Europa 2016

Hideyuki Wada
Staff Engineer
Canon Inc., NGL Development Division 3


Hideyuki Wada received his B.S. degree in physics from Osaka University in Japan, in 1990, and then started his career in semiconductor industry when he joined IBM Microelectronics Division where he was engaged in the semiconductor manufacturing process development as a photolithography engineer and process integration engineer. After 12 year experience with semiconductor device manufacturing, he entered a graduate school at the University of California at Los Angeles and then received his M.S. degree in electrical engineering in 2004. He had been working as a director of applications engineering to support customers for their nanoimprint technology developments in Japan and other countries in Asia, after he joined Molecular Imprints, Inc. in 2004. When the semiconductor business of Molecular imprints, Inc. was acquired by Canon Inc. in April 2014, he moved to newly established Canon Nanotechnologies, Inc., and then moved to Canon Inc.

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