SEMICON Europa 2016
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Jürgen
Wolf
Jürgen Wolf
Head of Department, Management ASSID
Fraunhofer Institute for Reliability and Microintegration IZM
M. Juergen Wolf received a M.S. degree in Electrical Engineering. In 1994, M. Juergen joined Fraunhofer Institute for Reliability and Microintegration IZM and worked e.g. as group & project manager in the field of wafer level packaging and system in package. Since 2011 he is head of the department Wafer Level System Integration and also coordinates and manages “ASSID - All Silicon System Integration Dresden” with its 300 mm WL process line. He manages as well as participates in a number of research projects on European and international level. Wolf is European representative in the technical working group Assembly & Packaging of ITRS, board member of EURIPIDES as well as member of IEEE and SMTA. He has (co) authored numerous scientific papers and reports in the field of microelectronic packaging and holds a number of patents.
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