SEMICON Europa 2016

Hugo Pristauz
VP Technical Development & Advanced Technology
Besi, Die Attach


Since begin of the millennium Dr. Hugo Pristauz has been working in equipment business for emerging semiconductor packaging technologies.

After making his PhD in the field of control science at TU Graz in 1990 and starting his industrial career in an automation company he entered semiconductor business by joining Datacon in 1999, soon being assigned to a product manager position in order to manage the development and marketing of the successful 8800 Flip Chip platform, followed by a VP R&D position for Datacon's entire R&D activities.

After acquisition of Datacon by Besi Hugo Pristauz was assigned in VP position to emerging business responsibilities for RFID Assembly (2005+), the entire Besi Flip Chip product line (2009+), and Besi Thermo Compression Bonding & Wafer Level Fan-Out business (2014+).

Since begin of 2016 Hugo Pristauz is focusing on technology scouting and networking in order to support Besi's roadmap alignment process for advanced die attach equipment, supervising equipment key technology developments while coaching top flight R&D teams.


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