Aehr Test Systems Announces Delivery of New FOX-XP™ Wafer Level Test and Burn- in
System
Fremont, CA (February 29, 2016) – Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of
semiconductor test and burn-in equipment, today announced that it has received customer acceptance for and
delivered its first FOX-XP Wafer Level Test and Burn-in System. The order included multiple FOX-XP WaferPak
Contactors and application development services. The delivery occurred in the third quarter of Aehr Test’s fiscal
2016, which closes on February 29, 2016.
Gayn Erickson, President and CEO of Aehr Test Systems, commented, “We are very excited to have delivered
this first FOX-XP system and are pleased with the performance of this latest member of our FOX-P family. This
system is configured for a single wafer but is scalable in our production systems for up to 25 wafers or more in
parallel in a single test cell. In addition, this unique multi-wafer system uses our proprietary WaferPak wafer
contactor, which is a critical portion of the solution for this particular application, due to certain specific technical
requirements for testing and handling these wafers.
“This FOX-XP system and the WaferPak Contactors will be used for reliability and qualification test of sensor
devices intended for a very high volume application. We believe our high power FOX-XP multi-wafer system is a
perfect fit for this application and represents a significant new opportunity as this device moves into high volume
manufacturing with wafer level burn-in. We believe the success of the engineering tests that are being run on this
system will lead to volume production orders from this customer. This customer anticipates that they will need a
significant number of systems to meet their device volume shipments beginning in the fourth quarter of this
calendar year and ramp through the entire calendar years 2017 and 2018.”
Aehr Test’s FOX-XP system is the company’s next-generation multi-wafer test solution that is capable of
functional test and burn-in/cycling of flash memories, microcontrollers, sensors, and other leading- edge ICs in
wafer form before they are assembled into single or multi-die stacked packages or for non-packaged die sales or
applications where known good die is critical. These singulated die or single-die or stacked-die packaged parts
can then be used for high reliability and quality applications such as enterprise solid state drives, automotive
devices, highly valuable mobile applications, and mission critical integrated circuits and sensors. The FOX-XP
system utilizes Aehr Test's FOX WaferPak contactor, which provides a cost effective solution for making electrical
contact with a full wafer or substrate in a multi-wafer environment. Aehr Test’s WaferPak contactors contain up to
tens of thousands of probes to contact all devices on wafers and substrates up to 300mm simultaneously. The
FOX-XP system is being developed in configurations of 25 wafers in parallel in a single cell to operate within an
efficient manufacturing space footprint. Aehr Test estimates the test equipment and consumables for the
emerging multi-wafer level test and burn-in market will add $200 million to $300 million to its served available
market.
About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in
and testing logic and memory integrated circuits and has an installed base of more than 2,500 systems
worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are
driving additional test requirements, capacity needs and opportunities for Aehr Test products in package and
wafer level test. Aehr Test has developed and introduced several innovative products, including the ABTSTM and
FOX families of test and burn-in systems and the DiePak® carrier. The ABTS system is used in production and
qualification testing of packaged parts for both lower-power and higher-power logic as well as all common types of
memory devices. The FOX system is a full wafer contact test and burn-in system used for burn-in and functional
test of complex devices, such as leading-edge memories, digital signal processors, microprocessors,
microcontrollers and systems-on-a-chip. The DiePak carrier is a reusable, temporary package that enables IC
manufacturers to perform cost-effective final test and burn-in of bare die. For more information, please visit the
Company’s website at www.aehr.com.