Aehr Test Systems Announces $1.7 Million Follow-On Order for ABTS™ Burn-in and
Test Systems from Leading IC Manufacturer
Fremont, CA (June 25, 2015) - Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor
test and burn-in equipment, today announced that it has received a $1.7 million follow-on order for its Advanced
Burn-in and Test Systems (ABTS) from a leading multi-national manufacturer of advanced logic integrated circuits
(ICs) for automotive, embedded processing, digital signal processing and analog applications. The order includes
prepayments in order to lock in short lead times and special pricing, and the systems are expected to ship within
the next six months.
“We are pleased to receive this follow-on order for additional systems,” said Mark Allison, vice president of sales
at Aehr Test Systems. “The customer is running at full capacity in their production burn-in and test area and
needed to add capacity quickly due to increasing demand for their advanced automotive devices. The ABTS
systems, with their individual temperature control capability for high-power devices, are a key part of the
customer’s quality and reliability program for their expanding line of automotive products.”
“Automobiles are making increasing use of infotainment, safety and communications systems,” said Carl Buck,
vice president of marketing at Aehr Test. “These systems consist of a range of electronic functions from sensing,
through conversion and transmission to high-performance processing, requiring the full spectrum of analog and
embedded processing ICs. For example, Advanced Driver Assistance Systems employ processors and sensors
which enable multiple vision and radar systems for applications such as lane departure warning, rearview and
surroundview camera systems, and collision warning and avoidance as well as blind spot detection. The
manufacturers of the components of these systems are required to meet the exacting quality and reliability
standards of the automotive market. Our systems provide our customers with the ability to screen out devices with
latent defects in order to meet those stringent reliability requirements.”
The ABTS family of products is based on a new hardware and software platform that is designed to address not
only today’s devices, but also future devices for many years to come. It can test and burn-in both logic and
memory devices, including resources for high pin-count devices and configurations for high-power and low-power
applications. ABTS systems can be configured with up to 72 burn-in boards, up to 320 I/O channels, 32M of test
vector memory per channel and up to 16 independent device power supplies. The ABTS system is optimized for
use with the Sensata iSocket* Thermal Management Technology, which provides a scalable cost-effective
solution using individual device temperature control for up to 64 devices per burn-in board and up to 75 watts per
device or more. Individual temperature control enables high-power devices with a broad range of power
dissipation to be burned-in simultaneously in a single burn-in chamber while maintaining a precise device
temperature. The ABTS system also uses N+1 redundancy technology for many key components in the system to
maximize system uptime.
*iSocket is a trademark of Sensata Technologies, Inc.
About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in
and testing logic and memory integrated circuits and has an installed base of more than 2,500 systems
worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are
driving additional test requirements, capacity needs and opportunities for Aehr Test products in package and
wafer level test.
Aehr Test has developed and introduced several innovative products, including the ABTS and FOXTM families of
test and burn-in systems and the DiePak® carrier. The ABTS system is used in production and qualification testing
of packaged parts for both low-power and high-power logic as well as all common types of memory devices. The
FOX system is a full wafer contact test and burn-in system used for burn-in and functional test of complex
devices, such as leading-edge memories, digital signal processors, microprocessors, microcontrollers and
systems-on-a-chip. The DiePak carrier is a reusable, temporary package that enables IC manufacturers to
perform cost-effective final test and burn-in of bare die. For more information, please visit Aehr Test’s website at
www.aehr.com.