SEMICON West 2016
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SHENMAO Introduces BGA and Micro BGA Solder Sphere
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made to various diameters of 0.76, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia. with accurate uniformity and high quality sphericity.
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