SEMICON West 2016
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SHENMAO BGA and Micro BGA Bumping Solder Paste
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process, optimizing manufacturing performance. World’s largest IC OSAT's utilize SHENMAO Bumping Solder Paste.
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