ASMPT manufactures materials & equipment for the assembly of IC, COB, COG, Power & LED products
Materials include:
- MIS
- Stamped LFs
- Etched LFs
- LED LFs
Equipment includes:
- Die bonders for Epoxy, Eutectic, Solder, FlipChip & TCB Processes
- Lens Holder bonder & AutoFocus system for CIS assembly
- LED Die Probers & wafer map Sorter
- Integrated LED tester
- Wire bonders for Aluminum/Gold Wedge
- Wire bonders for AU/CU/AG Ball and AU/CU Stud bumps
- Encapsulation systems for ICs w/ strip, Reel-Reel, wafer level processing
- Silicon Liquid Molding for LEDs
- Trim/Form/Singulation systems for leadframes
- Saw/Sort/Singulation systems for QFN/CSPBGA applications
- Test Handlers for LED and IC singulated units (turret handling)
- Integrated test for Strip & Matrix handling
- Laser Mark handling systems for strip based stand alone laser marking
- Solder Ball Attach & reflow ovens
- Dispense/Jetting Systems for Underfill/Gloptop/Phosphor processing
- Epoxy Cure & solder reflow ovens
- Laser Dicing systems
- LowK Wafer Grooving
Product Categories
200 Packaging and Assembly Equipment
- Ball Placement; Attach Systems
- Cleaning; Washing Equipment for Assembly & Packaging
- Cut & Down Set; Trim; Form Equipment
- Dicing; Sawing; Scribing; Separation Equipment
- Die Bonding; Attach Equipment
- Die Sorter; Pick & Place; Flip Chip Placement Systems
- Dispensing Systems
- Lead Frame Taping Systems
- Molding; Encapsulation; Decapsulation Equipment
- Package Handling; Conveying Equipment
- Solder Reflow; Soldering & Brazing Equipment
- Wafer Level Bonders
- Wire Bonding Equipment
202 Other Equipment
- Cutting; Drilling; Laser ablation; Beveling Equipment
- Molding; Encapsulation; Decapsulation Equipment
203 Inspection & Measurement Products
- Wire Bonding Inspection; Test
204 MEMS Equipment
- Wafer Level Bonders
207 Process Equipment
- Cleaning; Washing Equipment for Assembly & Packaging
208 Test Equipment
- Discrete Component Test Systems
- Handlers; Positioner Systems
- Optical Test Systems
- Package Test Systems
300 Packaging and Assembly Materials
- Lead Frames & Headers: Etched; Stamped
602 Manufacturing Software
- Factory Automation; Cell Controller Software