Boschman Technologies is the world's leading supplier of automatic molding systems using Film Assisted Molding (FAM) technology. QFN, SENSOR, MEMS, SOLAR and other unique applications where bond pads, heat sinks, window or exposed die surfaces must be kept free of mold compound or resin bleed are ideally suited for our cost effective technology. As a holder of many FAM related patents, Boschman brings unique and proven solutions. In addition, Boschman provides automatic molding solutions for conventional semiconductor devices and reel to reel smartcards. Advanced Package Center (APC), offers a one-stop shop for delivery of research, development, qualification, prototyping and small volume manufacturing services. By working closely with customer R&D departments to explore new packaging concepts, APC provides value from Innovation to Industrialization. Open cavity packages, open cavity molding capabilities and sintering systems are also available.
Product Categories
101 Photovoltaic Device Manufacturing
- PV: Cells
200 Packaging and Assembly Equipment
- Die Bonding; Attach Equipment
- Molding; Encapsulation; Decapsulation Equipment
206 PV Equipment
- Cells
701 Manufacturing Services or Consulting
- Assembly