Atotech’s semiconductor technology provides process solutions for advanced wafer metallization - from chip interconnects to wafer level packaging technologies. Electrochemical and electroless deposition techniques are used to plate Cu, Pd, Ni, Au and Sn for a variety of applications. These range from damascene plating over pad surface treatment to metallization of TSV for 3D integration. Being close to its customers is a top priority for Atotech. Its’ regional TechCenters for semiconductor technology development are equipped to provide the industry and local clients with customized products and top-of-the-line plating support. Chemistry production is done in our state-of-the-art manufacturing facilities. Special focus is placed on quality assurance, the use of leading technology and extensive R&D programs. Atotech is committed to developing and implementing innovative and sustainable technologies that allow our customers to minimize production costs, reduce their environmental footprint, and improve process efficiency.
Product Categories
207 Process Equipment
- Plating; Electro Chemical Plating; Deposition Systems
301 Chemicals & Solids
- Other Specialty Chemicals
307 Process Materials
- Plating Materials
700 Manufacturing Services
- Plating; Electro Polishing; Coating; Surface Treatment