With a proven track record spanning over three decades, ASE, the OSAT market leader, continues its tradition of manufacturing expertise through orchestrated collaboration with customers, suppliers and partners, alike. Alongside a broad portfolio of established technologies, ASE is also delivering innovative advanced packaging, System-in-Package and MEMS solutions to meet growth momentum across a broad range of end markets. For many emerging IoT and wearables players, success within an increasingly dynamic market hinges on creating and sustaining solid and highly productive manufacturing partnerships. ASE has inordinate ability to collaborate closely with customers, to understand markets and create truly compelling value propositions.
For more about our advances in Wire Bond, System-in-Package, Wafer Level Packaging, Fan Out, Flip Chip, MEMS & Sensors, and, 2.5D & 3D technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit : www.aseglobal.com
Product Categories
- Assembly
- Manufacturing Process Support and Development
- Package Mat'ls; Interconnect; Subassembly Design Svcs
- Package Simulation; Characterization Services