ATV manufactures thermal processing equipment: IR VACUUM REFLOW Soldering and BRAZING OVENS/RTAs, tabletop and stand alone, nearly 400 units worldwide, to 1100°C, high vacuum and pressurized, with H2/plasma and Formic Acid atmosphere for: perfectly void free solder joints, IGBT, CSP, DBCs, CPV, MMIC, Flip Chip, alloying, wafer bump reflow, Getter activation with package sealing, encapsulation, QUARTZ TUBE Furnaces, over 400 units worldwide, up to 300 mm, fast ramping, multipurpose, floor space and energy saving, for: LPCVD, oxidation, diffusion, high vacuum, H2, annealing, alloying, LTCC sintering, thick film paste firing, HOT PLATES: to 450°C, Manual DIAMOND SCRIBERS: to 200 mm Si Wafers, Al2O3, glass, sapphire Micro-Manipulator: MANUAL DIE BONDER/dispenser for assembly/repair/test of HYBRIDS, LTCC sintering Press
European representative for BSET EQ providing solutions through gas plasma technology
Genius maker of vacuum reflow systems/thermal processing furnace
Product Categories
101 Photovoltaic Device Manufacturing
- PV: Cells
- Solar Thermal
200 Packaging and Assembly Equipment
- Ball Placement; Attach Systems
- Dicing; Sawing; Scribing; Separation Equipment
- Die Bonding; Attach Equipment
- Molding; Encapsulation; Decapsulation Equipment
- Solder Reflow; Soldering & Brazing Equipment
202 Other Equipment
- Molding; Encapsulation; Decapsulation Equipment
- Repair; Rework Equipment
206 PV Equipment
- Cells
- Wafers
207 Process Equipment
- Bumping Systems
- Deposition; (CVD, PVD, ALD, Plating)
- Deposition; PVD; Sputtering; Evaporation Equipment
- Thermal Processing
400 Components, Parts & Accessories
- Chucks for Wafer and other Substrates