As a manufacturer of precision measurement systems and semiconductor manufacturig equipment. Tokyo Seimitsu has been supplying the marketplace with machine control gages, surface texture measuring instruments, wafer probing machines and others systems based on our key capabilities in high-precision measurment and micro positioning technology.
Product Categories
200 Equipment, Assembly
- Dicing; Sawing; Scribing; Separation Equipment
- Die Sorter; Pick & Place; Flip Chip Placement Systems
201 Equipment, Flat Panel Display
- Scribe and Break Equipment
208 Equipment, Test
- Probing Equipment incl. Analytical; Circuit; Manual; E-Beam; Optical; Wafer Probers
307 Materials, Process
- CMP; Grind; Lap; Polish; Abrasive materials